Phone: 0755-27620900
Mail: sales@china-sam.com
It is suitable for flux residue cleaning before molding of high-capacity flip chip, sip, lead frame and other packaging devices. This equipment has been used in cleaning all kinds of semiconductor reliability equipment, such as fingerprint, camera module, communication, RF, power control, etc
SM-6700 has core technology and patents, and a variety of options to meet user optimization process and control costs.
Add: 1 Floor, 13 Building, HongFa Industrial Park, Tangtou Road 91, Shiyan Town, Baoan District, Shenzhen, China
Tel:0755-27620900
Mail:sam888@china-sam.com
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