2020 21st International Conference on Electronic Packaging Technology (ICEPT)

来源：总管理员   发布时间[2020-08-16]

Our company participated in the "2020 21st International Conference on Electronic Packaging Technology (ICEPT)" from August 12 to 15, 2020. This conference is one of the most famous electronic packaging technology conferences in the world and won the full strength of IEEE-EPS Supported and highly praised by the Chinese Institute of Electronics and the China Association for Science and Technology, it has become one of the four major international brand conferences in the field of electronic packaging.

The conference was organized around ten topics including advanced packaging, interconnection technology, power electronics, packaging materials and processes, optoelectronic displays, modeling and simulation, packaging technology and equipment, quality and reliability, micro-electromechanical and fan-out packaging, and packaging in emerging fields. In-depth discussion.